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New Courses!
New Course in Fall 2026–MSE 597 (Materials for Biomedical Devices) New Course in Fall 2026–MSE 597 (Materials for Biomedical Devices) CHE medical device elective course for Spring 2026 CHE medical device elective course for Spring 2026 Semiconductor & Microelectronics Certificate Semiconductor & Microelectronics Certificate New Course: MSE 49700 Python for Materials Data Science New Course: MSE 49700 Python for Materials Data Science

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Senior Design Travel

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150 Years of Engineering at Purdue

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Prof. Erk UG Summer Job

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Anduril Internships

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Owens Corning Visit

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Contour Summer 2026 Internship

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Rolls-Royce 2026 Emerging Talent roles Open

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WAAIME Scholarships

WAAIME scholarships open January 1–25 at www.waaime.org. References are due January 30. Here’s how you can help: Application link Learn more about WAAIME: Listen...

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Purdue - BS1
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CCO Sp26 Workshop Calendar

Spring 26 CCO Workshop Calendar - Untitled Page-2Download

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The Copper Club 2026 Scholarship

2026 Scholarship Flyer - CopperDownload

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contour hardening
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Contour Summer 2026 Internship

We are looking for a Purdue MSE intern for the upcoming summer and were wondering if you could post our information again...

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Indy Engineering Graduate Programs

Indianapolis Engineering Graduate Programs- 2026 only- For Purdue undergradsDownload

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PARADIM REU Program

Program Projects Apply Past Participants World-Class Research Opportunities PARADIM REU projects include improving techniques to grow and characterize materials, developing new tools for...

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Purdue - BS1
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PESC EXPO Scholarship

Hello Purdue Students, The Purdue Engineering Student Council (PESC) is excited to announce that the application for the 2026 EXPO...

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BenchChem Research Excellence Scholarship 2025

BenchChem Research Excellence Scholarship 2025, which offers three awards of USD $1,000 to recognize outstanding student researchers in the sciences and engineering....

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Zimmer Biomet

https://careers.zimmerbiomet.com/us/en/job/7701/Research-Engineer-I

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ME597 Fundamentals of Microsystems Packaging

Course Title: ME597 Fundamentals of Microsystems Packaging Schedule: T/Th 3-4:15pm in Spring 2026 Location: ME 1012 Brief Description: This course provides a hands-on introduction...

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