ME597 Fundamentals of Microsystems Packaging

Course Title: ME597 Fundamentals of Microsystems Packaging

Schedule: T/Th 3-4:15pm in Spring 2026

Location: ME 1012

Brief Description: This course provides a hands-on introduction to fundamentals of 3D-HI and advanced packaging. The course is divided into eight modules to systematically discuss the fundamentals of electro-thermo-mechanical analysis aspects, materials, metrology and reliability for microsystems packaging. The concepts of optoelectronics packaging and MEMS sensor packaging will also be introduced. Case studies on packaging technologies for harsh environment, SWaP applications, high performance computing and communications will be discussed. About 5-10 Industry guest lectures will be incorporated for students to get exposure on state-of-art Advanced Packaging Technologies. Hands-on lab demonstrations will be incorporated for the students on major topics of electro-thermo-mechanical design, fabrication and metrology.

Reference Text: Fundamentals of Microsystems Packaging, by Prof. Rao R Tummala