ME597 Fundamentals of Microsystems Packaging
Course Title: ME597 Fundamentals of Microsystems Packaging Schedule: T/Th 3-4:15pm in Spring 2026 Location: ME 1012 Brief Description: This course provides a hands-on introduction...
Course Title: ME597 Fundamentals of Microsystems Packaging Schedule: T/Th 3-4:15pm in Spring 2026 Location: ME 1012 Brief Description: This course provides a hands-on introduction...
The Virtual Twins@Birck VIP team has asked that we circulate this poster highlighting the details of different topics they are planning...
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Dear Students, If you are doing an Internship for Summer, please register for MSE 39699. This is Zero Cost to...
Dear Advisors in the College of Engineering, I hope you’re doing well! I wanted to share with you some news...
ChE 59700 Med Device Syllabus_Spring 2025_shortDownload